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| Feature |
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APEX AGP is a mixed material with ceramic filler and silicone elastomer,
and used for a thermal interface between heat sink, cooling devices, metal
case, and a heat emitting device such as CPU, IC, or PCB.APEX AGP had
been imported 100 %, but the localization was made in Korea. Error occurrence
and inefficient functioning are caused by the heat emitted from CPU, Module,
IC, or TR, which are used in a ultra-mini electronic goods of the recent
electronic communication field.
In order to prevent such occurrences, APEX AGP absorbs and discharges
the heat, which is a major cause of the problem, so that it stabilizes
the function of the machines and reduces the error occurrence. Moreover,
APEX AGP is a gel type soft thermal pad, which has shock absorber and
dust-proof functions. It also has a self close adherence feature and is
an additional response type.
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| Characteristics |
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Thermal and chemical safety (temperature range for use is -40¡É~
200¡É) Since it has high self viscosity, it is unnecessary to
attach acrylic double sided tape for extra viscosity. Since it is a silicone
base, physical property such as thermal conductivity, viscosity, or flexibility
does not change, contrary to acryl adhesives, during a radical cooling
cycle.
Excellent close adherence flexibility and thermal conductivity
Thermal conductivity (1.7W/m.k) and close adherence are excellent, hence
there is no air layer on the contacting surface with a heat sink.
Good mechanical strength and operational efficiency
APEX AGP (thickness: 0.5mm) is supplemented by a net fiber, enabling a
safe usage in terms of the strength. Recycling and repairing are also
easy.
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| Usage |
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It is used in IC, module, back panel of TFT-LCD and PDP, and in semiconductor
device, mobile phone, laptop, CD-ROM, HDD, and RD RAM etc.
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| Kinds |
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AGP-1700 series, AGP-1000 series, AGP-F-1000 series
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